- High thermoforming performance
- Good mechanical properties
- Excellent brilliance and transparency
- Excellent gas/aroma barrier properties
Filmon® CS
The cast non-oriented nylon (CPA) film is well-suited to thermoforming processes, provides outstanding transparency and brilliance.
Properties
FILMON® CS PRODUCT RANGE
Proprieties | Applications | Thicknesses | |
---|---|---|---|
CS | One side corona treated | General purpose | 20-30-40-50-60-70-80-100 μm |
CXS | One side corona treated | General purpose | 18 μm |
CSM | Improved thermoformability | Improved performance on TFFS machines | 35-40-50-55-70-80-90-95-100-115 μm |
CXEB | PA/EVOH/PA | High barrier packaging | 25-40-80 μm |
CXHB | PA/EVOH/PA | Very high barrier packaging | 20-30-40 μm |
Technical properties
This product family offers a spectrum of technical properties to meet even the most demanding specifications.
1,13 | Thick | Dens | Unit Weight | Haze (ASTM D2003) | Tensile Strenght (ASTM D882) | Tensile E-Modulus (ASTM D882) | O2 T.R.@23°/65% R.H. (ASTM F1927) | W.V.T.R@38°/90% R.H. (ASTM F1249) | FLEX CRACK Resistance (Gelbo Flex Test) | Puncture Resistance | Impact Resistance (ASTM D3420) | ||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
CS | μm | (g/cc) | (g/m2) | (%) | Stress @ break (kg/mm2)MD | Stress @ break (kg/mm2)TD | Elongation @ break (%)MD | Elongation @ break (%)TD | (kg/mm2) MD | (kg/mm2) TD | (cc/m2/24h/atm) | (g/m2/24h) | (N. of pinholes/1000 cycles) | Round probe 2mm (N) | Spencer Pendulum Impact test |
18 | 1,13 | 20,3 | 4,5 | 13,5 | 10,5 | 390 | 440 | 80 | 70 | 38 | 320 | 0+1 | 10 | Not broken | |
50 | 1,13 | 56,5 | 5.0 | 11,0 | 10,0 | 530 | 530 | 80 | 70 | 14 | 115 | 0+2 | 22 | Not broken | |
100 | 1,13 | 113,0 | 8.5 | 10,0 | 9,0 | 540 | 540 | 80 | 70 | 7 | 55 | 0+2 | 36 | Not broken |
Solutions
FILMON® CS (CPA) film products offer a unique combination of mechanical, aroma/gas barrier and brilliancy and transparency properties. And with their excellent thermoformability, they make an ideal solution for a host of applications and processing techniques.